Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M1AFS250-2FG256 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | DDR Frequency 25/Jan/2013 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Fusion® | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 36864 | |
| Number of I/O | 114 | |
| Number of Gates | 250000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M1AFS250-2FG256 | |
| Related Links | M1AFS25, M1AFS250-2FG256 Datasheet, Microsemi SoC Distributor | |
![]() | 63537-2 | Connector Quick Connect Receptacle 14-18 AWG 0.250" (6.35mm) Crimp | datasheet.pdf | |
![]() | MIC37100-3.3BS | IC REG LDO 3.3V 1A SOT223 | datasheet.pdf | |
![]() | T18101KT10 | TRIMMER 100 OHM 0.75W TH | datasheet.pdf | |
![]() | TNPW1206215KBEEA | RES SMD 215K OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | MAX3232EEUP+T | IC TXRX RS232 250KBPS LP 20TSSOP | datasheet.pdf | |
![]() | ECQ-V1123JM5 | CAP FILM 0.012UF 5% 100VDC RAD | datasheet.pdf | |
![]() | AML26GBB2AA03GR | SWITCH ROCKER SPDT 3A 125V | datasheet.pdf | |
![]() | ATS-18H-44-C2-R0 | HEATSINK 25X25X15MM L-TAB T766 | datasheet.pdf | |
![]() | ATS-07B-109-C1-R1 | HEATSINK 54X40X9.5MM XCUT | datasheet.pdf | |
![]() | TXS2SS-LT-12V-1 | TXS RELAY 2 FORM C 12V | datasheet.pdf | |
![]() | T37002-11-0 | Connector Barrier Block Strip 11 Circuit 0.375" (9.53mm) | datasheet.pdf | |
![]() | F39-HB1345 | F39-HB1345 | datasheet.pdf |