Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M1AFS250-FG256I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | DDR Frequency 25/Jan/2013 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Fusion® | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 36864 | |
| Number of I/O | 114 | |
| Number of Gates | 250000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M1AFS250-FG256I | |
| Related Links | M1AFS25, M1AFS250-FG256I Datasheet, Microsemi SoC Distributor | |
![]() | RT0805DRD0748R7L | RES SMD 48.7 OHM 0.5% 1/8W 0805 | datasheet.pdf | |
![]() | 08051J2R4BAWTR | CAP THIN FILM 2.2PF 100V 0805 | datasheet.pdf | |
![]() | HTZ130B28K | DIODE MODULE 28KV 1A | datasheet.pdf | |
![]() | LR03XWA/BF6 | BATT PK 9V AAA SIZE ALKALINE | datasheet.pdf | |
![]() | 0ATO07.5V | FUSE AUTO 7.5A 32VAC/VDC BLADE | datasheet.pdf | |
![]() | VE-JVV-CY-F4 | CONVERTER MOD DC/DC 5.8V 50W | datasheet.pdf | |
![]() | EXD470TN | ANT TWO-WAY 470-490MHZ 1/4W TN | datasheet.pdf | |
![]() | DIN-016RSE-SR1-KR | CONN SOCKET DIN 16POS R/A GOLD | datasheet.pdf | |
![]() | 8N4SV76EC-0046CDI8 | IC OSC VCXO 200MHZ 6-CLCC | datasheet.pdf | |
![]() | 8T49N008A-051NLGI | IC CLK GEN LVDS/LVPECL 40VFQFN | datasheet.pdf | |
![]() | NTCD-CFG | MEMORY CARD | datasheet.pdf | |
![]() | GTC020R16S-4P-B30-025 | GT 2C 2#16S PIN RECP BOX | datasheet.pdf |