Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M1AGL250V5-FGG144 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | IGLOO | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 6144 | |
| Total RAM Bits | 36864 | |
| Number of I/O | 97 | |
| Number of Gates | 250000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 144-LBGA | |
| Supplier Device Package | 144-FPBGA (13x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M1AGL250V5-FGG144 | |
| Related Links | M1AGL250, M1AGL250V5-FGG144 Datasheet, Microsemi SoC Distributor | |
![]() | 8-320559-5 | CONN SPLICE BUTT 16-22 AWG RED | datasheet.pdf | |
![]() | 150-90-308-00-001000 | HEADER OPEN .018"DIA .300 8POS | datasheet.pdf | |
![]() | CRCW251210R0FKEG | RES SMD 10 OHM 1% 1W 2512 | datasheet.pdf | |
![]() | E2009QNLT | MODULE 10BASE-T INTRFACE 1:1.414 | datasheet.pdf | |
![]() | 3100 01820008 | THERMOSTAT 3100 SERIES HERMETIC | datasheet.pdf | |
![]() | 1897092 | TERM BLOCK HDR 2POS R/A 3.5MM | datasheet.pdf | |
![]() | LCMXO2-4000HE-6BG332C | IC CPLD 2160MC 6.72NS 332CABGA | datasheet.pdf | |
![]() | V375A24C600BF2 | CONVERTER MOD DC/DC 24V 600W | datasheet.pdf | |
![]() | 1770416 | PC TERM BLOCK 10MM 4POS GREEN | datasheet.pdf | |
![]() | CR0805-FX-2202ELF | RES SMD 22K OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | TS14318B00J0G | 381 TB PLU PLU HOOK/BACK | datasheet.pdf | |
![]() | GRT155R6YA474KE01D | CAP CER 0.47UF 35V 10% X5R 0402 | datasheet.pdf |