Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M25P16-VME6G | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Assembly/Origin | Assembly Site Transfer 11/Nov/2014 | |
| Standard Package | 1,920 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | FLASH | |
| Memory Type | FLASH - NOR | |
| Memory Size | 16M (2M x 8) | |
| Speed | 75MHz | |
| Interface | SPI Serial | |
| Voltage - Supply | 2.7 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 8-VDFN Exposed Pad | |
| Supplier Device Package | 8-VDFPN (MLP8) (8x6) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M25P16-VME6G | |
| Related Links | M25P16, M25P16-VME6G Datasheet, Micron Technology Distributor | |
![]() | AH715269-A | SWITCH MINI SPDT HINGE LVR.187QC | datasheet.pdf | |
![]() | BGW200EG/01,515 | IC WLAN SIP MOD 802.11B 68HVQFN | datasheet.pdf | |
![]() | ATS-56008-C4-R0 | HEAT SINK 50MM X 45MM X 16MM | datasheet.pdf | |
![]() | ACD-15 PRO | DMM CLAMP-ON 2000A | datasheet.pdf | |
![]() | 3-1624117-1 | FERRITE CHIP 300 OHM 600MA 0805 | datasheet.pdf | |
![]() | 1825459 | TERM BLOCK PLUG 16POS STR 5.08MM | datasheet.pdf | |
![]() | RN55D1002FRE6 | RES 10K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | 929984-01-32-RK | Connector Receptacle 32 Position 0.100" (2.54mm) Tin Through Hole | datasheet.pdf | |
![]() | PIC16LF1789-E/P | IC MCU 8BIT 28KB FLASH 40DIP | datasheet.pdf | |
![]() | ATS-19B-88-C1-R0 | HEATSINK 35X35X25MM R-TAB | datasheet.pdf | |
![]() | XC4013E2PQ240C-0402 | IC FPGA 160 I/O 208QFP | datasheet.pdf | |
![]() | RDED72J564MUE1C13A | Ceramic Capacitors 0.56UF 630V 20% RADIAL | datasheet.pdf |