Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2GL005-VF256 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
| Standard Package | 119 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | IGLOO2 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 6060 | |
| Total RAM Bits | 719872 | |
| Number of I/O | 148 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 256-LFBGA | |
| Supplier Device Package | VF256 (14x14) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2GL005-VF256 | |
| Related Links | M2GL00, M2GL005-VF256 Datasheet, Microsemi SoC Distributor | |
![]() | LX-DB800-EVAL-KIT | KIT DEV ZOOM GEODE LX800 | datasheet.pdf | |
![]() | 183E20 | XFRMR LAMINATED 2.5VA THRU HOLE | datasheet.pdf | |
![]() | 305-036-521-204 | CONN CARDEDGE 36POS .156 GREEN | datasheet.pdf | |
![]() | CD10FD131FO3F | CAP MICA 130PF 1% 500V RADIAL | datasheet.pdf | |
![]() | SPP-4E70 | FUSE MOD 70A 700V BLADE | datasheet.pdf | |
![]() | C566C-AFN-CU0W0252 | LED AMBER DIFF 5MM OVAL T/H | datasheet.pdf | |
![]() | FX16-31P-HC | CONN FFC PLUG 31POS 0.50MM | datasheet.pdf | |
![]() | 7107L3YZQE3 | SWITCH TOGGLE SPDT 5A 120V | datasheet.pdf | |
![]() | PIC32MX330F064L-V/PT | IC MCU 32BIT 64KB FLASH 100TQFP | datasheet.pdf | |
![]() | 5450272 | TERM BLOCK PLUG | datasheet.pdf | |
![]() | ATS-01A-89-C3-R0 | HEATSINK 35X35X30MM R-TAB T412 | datasheet.pdf | |
![]() | 10-069518-12S | ER 6C 6#16 SKT PLUG | datasheet.pdf |