Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2GL010-FGG484 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | IGLOO2 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 12084 | |
| Total RAM Bits | 933888 | |
| Number of I/O | 233 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 484-BGA | |
| Supplier Device Package | 484-FPBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2GL010-FGG484 | |
| Related Links | M2GL010, M2GL010-FGG484 Datasheet, Microsemi SoC Distributor | |
![]() | 60618-1 | CONN PIN 18-24AWG TIN CRIMP | datasheet.pdf | |
![]() | 12063F104K4T2A | CAP CER 0.1UF 25V X8R 1206 | datasheet.pdf | |
![]() | TLV70225DBVR | IC REG LDO 2.5V 0.3A SOT23-5 | datasheet.pdf | |
![]() | DTS24W25-20SA | CONN RCPT 30POS JAM NUT W/SKT | datasheet.pdf | |
![]() | STGFW35HF60W | IGBT 600V 36A 88W TO3PF | datasheet.pdf | |
![]() | 0801406:0031 | TERM BLOCK MARKER | datasheet.pdf | |
![]() | ATS-16C-77-C1-R0 | HEATSINK 25X25X30MM R-TAB | datasheet.pdf | |
![]() | SC01P-22-63P | CONN RCPT 12POS INLINE PIN | datasheet.pdf | |
![]() | KC3225A16.0000C3GE00 | OSC XO 16MHZ CMOS SMD | datasheet.pdf | |
![]() | 0397230012 | 762MM EURO HDR RA CE 12CGREEN | datasheet.pdf | |
![]() | CTVP00RW-25-11P-LC | CTV 11C 2#20 9#10 PIN RECP | datasheet.pdf | |
![]() | MB25101JAN | HIGH FREQUENCY CERAMIC CAPACITORS | datasheet.pdf |