Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2GL010T-1FGG484I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | IGLOO2 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 12084 | |
| Total RAM Bits | 933888 | |
| Number of I/O | 233 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 484-BGA | |
| Supplier Device Package | 484-FPBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2GL010T-1FGG484I | |
| Related Links | M2GL010T, M2GL010T-1FGG484I Datasheet, Microsemi SoC Distributor | |
![]() | SQP10AJB-11R | RES 11 OHM 10W 5% AXIAL | datasheet.pdf | |
![]() | 8429 | HEX STANDOFF 8-32 ALUMINUM 3/4" | datasheet.pdf | |
![]() | RT0402BRD0752R3L | RES SMD 52.3 OHM 0.1% 1/16W 0402 | datasheet.pdf | |
![]() | PZU5.6BA,115 | DIODE ZENER 5.6V 320MW SOD323 | datasheet.pdf | |
![]() | PTN1206E4073BST1 | RES SMD 407K OHM 0.1% 0.4W 1206 | datasheet.pdf | |
![]() | 1-1622821-3 | RES SMD 0.022 OHM 5% 1/4W 1220 | datasheet.pdf | |
![]() | VE-B4D-CX-F2 | CONVERTER MOD DC/DC 85V 75W | datasheet.pdf | |
| TSL2563T | IC LIGHT TO DGTL CONV 6-TMB | datasheet.pdf | ||
![]() | 2455RC-99890905 | AUTO RESET THERMOSTAT | datasheet.pdf | |
![]() | ATS-15H-08-C3-R0 | HEATSINK 45X45X15MM XCUT T412 | datasheet.pdf | |
![]() | ATS-16D-155-C1-R0 | HEATSINK 40X40X20MM L-TAB | datasheet.pdf | |
![]() | 2-58172-0 | HDI SEATING TL, 4 ROW 75 POSN | datasheet.pdf |