Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2GL050TS-1FG896I | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 27 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | IGLOO2 | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | 56340 | |
Total RAM Bits | 1869824 | |
Number of I/O | 377 | |
Number of Gates | - | |
Voltage - Supply | 1.14 V ~ 2.625 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 896-BGA | |
Supplier Device Package | 896-FBGA (31x31) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2GL050TS-1FG896I | |
Related Links | M2GL050T, M2GL050TS-1FG896I Datasheet, Microsemi SoC Distributor |
![]() | 450D252F7 | POT 2.5K OHM 1/2W CARBON LINEAR | datasheet.pdf | |
![]() | MCR18EZHJ5R1 | RES SMD 5.1 OHM 5% 1/4W 1206 | datasheet.pdf | |
![]() | RG1608P-164-B-T5 | RES SMD 160K OHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | RG1005P-3320-C-T10 | RES SMD 332 OHM 0.25% 1/16W 0402 | datasheet.pdf | |
![]() | EEM24DRYI-S13 | CONN EDGECARD 48POS .156 EXTEND | datasheet.pdf | |
![]() | 4416W-1.5 | TAPE VINYL FOAM 1/16 X 1.5" WHT | datasheet.pdf | |
![]() | 2320-6121-TG | CONN HEADER 20POS .230 STR GOLD | datasheet.pdf | |
![]() | 0982670484 | 1MM JMPR LGT 254 TYPE D 30POS | datasheet.pdf | |
![]() | PAA.M0.4GL.AC52A | CONN INLINE PLUG 4PIN SLD CUP | datasheet.pdf | |
![]() | SRN2510-R24M | FIXED IND 240NH 3.1A 42 MOHM SMD | datasheet.pdf | |
![]() | MAGX-001214-SB3PPR | EVAL BOARD FOR MAGX-001214-500L0 | datasheet.pdf | |
![]() | VJ0603D130JXXAP | CAP CER 13PF 25V NP0 0603 | datasheet.pdf |