Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2GL060-FCS325 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
| Standard Package | 176 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | IGLOO2 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | 56520 | |
| Total RAM Bits | 1869824 | |
| Number of I/O | 200 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 325-TFBGA | |
| Supplier Device Package | 325-BGA (11x11) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2GL060-FCS325 | |
| Related Links | M2GL060, M2GL060-FCS325 Datasheet, Microsemi SoC Distributor | |
![]() | 2100HT-271-V | FIXED IND 270UH 2.8A 140 MOHM TH | datasheet.pdf | |
![]() | NB100LVEP56DT | IC MUX DUAL 2:1 DIFF ECL 20TSSOP | datasheet.pdf | |
![]() | MIC2563A-1YSM-TR | IC PCMCIA/CARDBUS DUAL 28-SSOP | datasheet.pdf | |
![]() | MP915-2.00-1% | RES 2 OHM 15W 1% TO126 | datasheet.pdf | |
![]() | RCM06DCWT | CONN EDGECARD 12POS DIP .156 SLD | datasheet.pdf | |
![]() | RBM15DSEI | CONN EDGECARD 30POS .156 EYELET | datasheet.pdf | |
![]() | 0395225011 | TERM BLOCK HDR 11POS R/A 5MM | datasheet.pdf | |
| 501HCH-ACAF | OSC PROG 0.7NS 20PPM 2.5X3.2MM | datasheet.pdf | ||
![]() | MPLAD15KP58AE3 | TVS DIODE 58VWM 93.6VC PLAD | datasheet.pdf | |
![]() | 2906937 | TERM HOUSING | datasheet.pdf | |
![]() | SIT1602AIT3-18S | OSC MEMS PROG 5.0X3.2MM 1.8V | datasheet.pdf | |
![]() | TVS06RF-15-18HB-LC | TV 18C 18#20 PIN PLUG | datasheet.pdf |