Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2GL090-1FG676I | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 40 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | IGLOO2 | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | 86316 | |
Total RAM Bits | 2648064 | |
Number of I/O | 425 | |
Number of Gates | - | |
Voltage - Supply | 1.14 V ~ 2.625 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 676-BGA | |
Supplier Device Package | 676-FBGA (27x27) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2GL090-1FG676I | |
Related Links | M2GL090, M2GL090-1FG676I Datasheet, Microsemi SoC Distributor |
![]() | 5TT 5 | FUSE GLASS 5A 125VAC 5X20MM | datasheet.pdf | |
![]() | VJ1808A102KBLAT4X | CAP CER 1000PF 630V NP0 1808 | datasheet.pdf | |
![]() | RGC0805FTC78R7 | RES SMD 78.7 OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | CF18JT4K30 | RES 4.3K OHM 1/8W 5% CARBON FILM | datasheet.pdf | |
![]() | 74ALVCH16827DGGRE4 | IC BUFF/DVR TRI-ST 20BIT 56TSSOP | datasheet.pdf | |
![]() | LNX2H822MSEJ | CAP ALUM 8200UF 20% 500V SCREW | datasheet.pdf | |
![]() | VI-2N1-MW-F4 | CONVERTER MOD DC/DC 12V 100W | datasheet.pdf | |
![]() | VE-B10-IW | CONVERTER MOD DC/DC 5V 100W | datasheet.pdf | |
![]() | LP3996SD-3333 | IC REG LDO 3.3V 10WSON | datasheet.pdf | |
![]() | ACC43DRSN | CONN EDGECARD 86POS .100" | datasheet.pdf | |
![]() | ATS-05A-157-C3-R0 | HEATSINK 40X40X30MM L-TAB T412 | datasheet.pdf | |
![]() | MKP1840233205M | CAP FILM 3300 PF 10% 2000VDC | datasheet.pdf |