Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2GL150-1FCS536I | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 176 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | IGLOO2 | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | 146124 | |
Total RAM Bits | 5120000 | |
Number of I/O | 293 | |
Number of Gates | - | |
Voltage - Supply | 1.14 V ~ 2.625 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 536-LFBGA | |
Supplier Device Package | 536-BGA (16x16) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2GL150-1FCS536I | |
Related Links | M2GL150-, M2GL150-1FCS536I Datasheet, Microsemi SoC Distributor |
![]() | 103670-5 | CONN HEADER VERT .100 6POS 15AU | datasheet.pdf | |
![]() | RG1608P-111-B-T5 | RES SMD 110 OHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | VJ2225A271JBAAT4X | CAP CER 270PF 50V NP0 2225 | datasheet.pdf | |
APXE160ARA330ME61G | CAP POLYMER 33UF 20% 16V SMD | datasheet.pdf | ||
![]() | FXO-PC735R-156.25 | OSC XO 156.25MHZ LVPECL SMD | datasheet.pdf | |
![]() | RNC55H3162BSBSL | RES 31.6K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | 2455RC390820202 | AUTO RESET THERMOSTAT | datasheet.pdf | |
![]() | 638X | 1MICRON DIAMOND LAPPING FILM | datasheet.pdf | |
![]() | D4SL-2KDG-D | D4SL-2KDG-D | datasheet.pdf | |
![]() | DAC1408D650W2-DB | BOARD DEMO FOR DAC1408D650W2 | datasheet.pdf | |
![]() | 55PC1224-24-2/6-9 | 55PC CABLE | datasheet.pdf | |
![]() | 55PC1141-12-9/93/95/96-9 | 55PC CABLE | datasheet.pdf |