Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2S010T-1VF256I | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 119 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 256KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 10K Logic Modules | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 256-VFBGA | |
Supplier Device Package | 256-BGA (17x17) | |
Number of I/O | 138 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2S010T-1VF256I | |
Related Links | M2S010T, M2S010T-1VF256I Datasheet, Microsemi SoC Distributor |
![]() | AGN200S03 | RELAY TELECOM DPDT 1A 3V | datasheet.pdf | |
![]() | 8018J1 | PC BOARD 3.94-6.3" PPH W/2MM J1 | datasheet.pdf | |
![]() | NJM2396F33 | IC REG LDO 3.3V 1.5A TO220F-4 | datasheet.pdf | |
![]() | ERJ-S12F18R2U | RES SMD 18.2 OHM 1% 3/4W 1812 | datasheet.pdf | |
![]() | 5-1879535-3 | RES SMD 348K OHM 1% 1/4W 1206 | datasheet.pdf | |
![]() | VE-B0J-IY-B1 | CONVERTER MOD DC/DC 36V 50W | datasheet.pdf | |
![]() | SMFLP2-6.5 | LIGHT PIPE 2MM 5.1 RND LENS 6.5 | datasheet.pdf | |
![]() | RNC55J16R2FSBSL | RES 16.2 OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | RWR81NR620FRB12 | RES 0.62 OHM 1W 1% WW AXIAL | datasheet.pdf | |
![]() | RN55E1073FB14 | RES 107K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | 712-83-118-41-001101 | PCB CONN CARRIER 2.54MM | datasheet.pdf | |
![]() | 89540-414HLF | HEADER BERGSTIK | datasheet.pdf |