Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2S025-FG484 | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 60 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 256KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 25K Logic Modules | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 484-BGA | |
Supplier Device Package | 484-FPBGA (23x23) | |
Number of I/O | 267 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2S025-FG484 | |
Related Links | M2S025, M2S025-FG484 Datasheet, Microsemi SoC Distributor |
![]() | EPS-200 3/8 | HEATSHRINK EPS200 3/8"X4' BLACK | datasheet.pdf | |
![]() | LMX2332UTM | IC FREQ SYNTHESIZER DUAL 20TSSOP | datasheet.pdf | |
![]() | 768163683GP | RES ARRAY 8 RES 68K OHM 16SOIC | datasheet.pdf | |
![]() | GBB75DHNT | CONN EDGECARD 150PS .050 DIP SLD | datasheet.pdf | |
![]() | MCR18EZHFLR330 | RES SMD 0.33 OHM 1% 1/4W 1206 | datasheet.pdf | |
![]() | OSTT5160150 | TERM BLOCK 3.50MM 16POS | datasheet.pdf | |
![]() | AFD56-16-23SN-6117-LC | CONN HSG PLUG STRGHT 23POS SKT | datasheet.pdf | |
![]() | XC6VLX760-1FF1760C | IC FPGA 1200 I/O 1760FBGA | datasheet.pdf | |
![]() | TEH70P39R0JE | RES 39 OHM 70W 5% TO247 | datasheet.pdf | |
![]() | ATS-01D-13-C3-R0 | HEATSINK 50X50X15MM XCUT T412 | datasheet.pdf | |
![]() | G02C-16-8P | CONN PLUG W/PINS | datasheet.pdf | |
![]() | SJT07RT-12-8S | CONN RCPT 8POS JAM NUT SCKT | datasheet.pdf |