Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2S050-FG896I | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 24 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 256KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 50K Logic Modules | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 896-BGA | |
Supplier Device Package | 896-FBGA (31x31) | |
Number of I/O | 377 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2S050-FG896I | |
Related Links | M2S050, M2S050-FG896I Datasheet, Microsemi SoC Distributor |
![]() | BD5225G-TR | IC DETECTOR VOLT 2.5V ODRN 5SSOP | datasheet.pdf | |
![]() | MCR10EZHF1603 | RES SMD 160K OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | ERJ-1TNF8253U | RES SMD 825K OHM 1% 1W 2512 | datasheet.pdf | |
![]() | ERJ-S1DF12R4U | RES SMD 12.4 OHM 1% 3/4W 2010 | datasheet.pdf | |
![]() | GMM36DRYI-S13 | CONN EDGECARD 72POS .156 EXTEND | datasheet.pdf | |
![]() | TNPW2512180RBEEG | RES SMD 180 OHM 0.1% 1/2W 2512 | datasheet.pdf | |
![]() | ABC-1-1/2-R | FUSE CERM 1.5A 250VAC 125VDC 3AB | datasheet.pdf | |
![]() | RWR78S3570FRB12 | RES 357 OHM 10W 1% WW AXIAL | datasheet.pdf | |
![]() | CMF5576R800FKR670 | RES 76.8 OHM 1/2W 1% AXIAL | datasheet.pdf | |
![]() | ATS-12C-95-C1-R0 | HEATSINK 40X40X30MM R-TAB | datasheet.pdf | |
![]() | DCME25W3S | COMBO-D 25W3 SCKT SLDR | datasheet.pdf | |
![]() | CPI0806J1R8R-10 | FIXED IND 1.8UH 1.2A 200 MOHM | datasheet.pdf |