Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2S050T-FCS325I | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 176 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 256KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 50K Logic Modules | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 325-TFBGA | |
Supplier Device Package | 325-BGA (11x11) | |
Number of I/O | 200 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2S050T-FCS325I | |
Related Links | M2S050T, M2S050T-FCS325I Datasheet, Microsemi SoC Distributor |
929647-09-35-I | CONN HEADER .100 SNGL STR 35POS | datasheet.pdf | ||
37680 | FOAM BLK COND CUSH GRD 1/8X37X57 | datasheet.pdf | ||
EBA14DTMD | CONN EDGECARD 28POS R/A .125 SLD | datasheet.pdf | ||
593D227X0010D2TE3 | CAP TANT 220UF 10V 20% 2917 | datasheet.pdf | ||
STK14CA8-NF25TR | IC NVSRAM 1MBIT 25NS 32SOIC | datasheet.pdf | ||
0674007.DRT4P | FUSE CERAMIC 7A 250VAC AXIAL | datasheet.pdf | ||
VE-25F-EW-F2 | CONVERTER MOD DC/DC 72V 100W | datasheet.pdf | ||
0152660398 | PREMO-FLEX LGT 229 TYPED 36POS | datasheet.pdf | ||
C917U180JYNDAAWL40 | CAP CER 18PF 400VAC NP0 RADIAL | datasheet.pdf | ||
3549S-1AD-103A | POT 10K OHM 2W WIREWOUND LINEAR | datasheet.pdf | ||
346-83-151-41-035101 | Connector Socket 51 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | ||
10-584460-07S | ER 8C 8#16 SKT PLUG | datasheet.pdf |