Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2S050TS-1FCSG325 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 176 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 256KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 50K Logic Modules | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 325-TFBGA | |
Supplier Device Package | 325-BGA (11x11) | |
Number of I/O | 200 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2S050TS-1FCSG325 | |
Related Links | M2S050TS, M2S050TS-1FCSG325 Datasheet, Microsemi SoC Distributor |
![]() | APA501-60-006 | HEATSINK (60) 57.5X59X37MM HORZ | datasheet.pdf | |
![]() | A22N-MR112 | LOWER-RAISE | datasheet.pdf | |
![]() | HFBR-7934HWZ | TXRX 4+4 3GBD PLUGGABLE EMI | datasheet.pdf | |
![]() | C1206X102J5GACTU | CAP CER 1000PF 50V NP0 1206 | datasheet.pdf | |
![]() | 8121J85ZGE623 | SWITCH PUSHBUTTON SPDT 1A 120V | datasheet.pdf | |
![]() | MI-J70-MZ-F3 | CONVERT DC/DC 165VIN 5VOUT 25W | datasheet.pdf | |
![]() | 74HC4049PW,118 | IC HEX INVERTER 1INPUT 16TSSOP | datasheet.pdf | |
![]() | CXA1512-0000-000N00N257F | LED ARRAY XLAMP CXA1512 WHITE | datasheet.pdf | |
![]() | BZM55B11-TR3 | DIODE ZENER 500MW MICROMELF | datasheet.pdf | |
![]() | H310CYGGDL | LED ASSY RA 3MM 3X1 Y/G/G DIFF | datasheet.pdf | |
![]() | TJ15A18000J0G | 750 TB PLUGGABLE PLUG | datasheet.pdf | |
![]() | 97-3102A28-2SY | AB 14C 12#16, 2#12 SKT RECP | datasheet.pdf |