Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2S090-1FGG484I | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 | |
Standard Package | 60 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 512KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 90K Logic Modules | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 484-BGA | |
Supplier Device Package | 484-FPBGA (23x23) | |
Number of I/O | 267 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2S090-1FGG484I | |
Related Links | M2S090-, M2S090-1FGG484I Datasheet, Microsemi SoC Distributor |
![]() | 928036-1 | LOCKING LATCH LONG VERSION | datasheet.pdf | |
![]() | RG2012P-3650-W-T1 | RES SMD 365 OHM 0.05% 1/8W 0805 | datasheet.pdf | |
![]() | RBB90DHNT | CONN EDGECARD 180PS DIP .050 SLD | datasheet.pdf | |
![]() | EMM31DTMD-S189 | CONN EDGECARD 62POS R/A .156 SLD | datasheet.pdf | |
![]() | E2E-X10D1-M1GJ-T 0.3M | SENS PROX M12 10MM DC2W-NO .3M | datasheet.pdf | |
![]() | CMF6051R100FLEB | RES 51.1 OHM 1W 1% AXIAL | datasheet.pdf | |
![]() | CA3101E14S-2SB | CONN RCPT 4POS INLINE W/SKTS | datasheet.pdf | |
![]() | 379-052-521-202 | CONNECTOR - PRINTED CIRCUIT | datasheet.pdf | |
![]() | CDRH2D09NP-5R6MC | FIXED IND 5.6UH 590MA 320 MOHM | datasheet.pdf | |
![]() | 70220-1146 | UMMYQ-0500-1750-A | datasheet.pdf | |
![]() | 68757-403HLF | HEADER BERGSTIK | datasheet.pdf | |
![]() | TVP00RW-19-99HA-LC | TV 23C 21#20 2#16 PIN RECP | datasheet.pdf |