Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2S090S-1FG676I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - System On Chip (SoC) | |
| Series | SmartFusion®2 | |
| Packaging | Tray | |
| Architecture | MCU, FPGA | |
| Core Processor | ARM® Cortex®-M3 | |
| MCU Flash | 512KB | |
| MCU RAM | 64KB | |
| Peripherals | DDR, PCIe, SERDES | |
| Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
| Speed | 166MHz | |
| Primary Attributes | FPGA - 90K Logic Modules | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 676-BGA | |
| Supplier Device Package | 676-FBGA (27x27) | |
| Number of I/O | 425 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2S090S-1FG676I | |
| Related Links | M2S090S, M2S090S-1FG676I Datasheet, Microsemi SoC Distributor | |
![]() | FQAF16N25C | MOSFET N-CH 250V 11.4A TO-3PF | datasheet.pdf | |
![]() | 37166 | ESD HANDLER 11-1/4X14-3/4X1-3/4 | datasheet.pdf | |
![]() | RYM15DTKN | CONN EDGECARD 30POS DIP .156 SLD | datasheet.pdf | |
![]() | SN74LV221ADBR | IC DUAL MONO MULTIVIB 16-SSOP | datasheet.pdf | |
![]() | G7TC-OC16 DC12V | RELAY BLOCK 16 REL. OUT | datasheet.pdf | |
![]() | SRS-2-590 | ROUND SPACER #6 PVC 14.99MM | datasheet.pdf | |
![]() | 0438796014 | MINI-FIT CPI HDR ASSY MF/BL | datasheet.pdf | |
![]() | RPP20-4805SW-L | 20W DC/DC-CONV POWERLINE-PLUS | datasheet.pdf | |
![]() | FDP039N08B_F102 | MOSFET N CH 80V 120A TO-220 | datasheet.pdf | |
![]() | ATS-19C-127-C1-R0 | HEATSINK 54X54X20MM XCUT | datasheet.pdf | |
![]() | 890324022007CS | CAP FILM 0.015UF 10% 275VAC RAD | datasheet.pdf | |
![]() | MAL215942102E3 | 1000UF 200V 30X45MM 105C 5000H | datasheet.pdf |