Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-M2S090S-1FGG484I | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 60 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 512KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 90K Logic Modules | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 484-BGA | |
Supplier Device Package | 484-FPBGA (23x23) | |
Number of I/O | 267 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | M2S090S-1FGG484I | |
Related Links | M2S090S-, M2S090S-1FGG484I Datasheet, Microsemi SoC Distributor |
![]() | ERJ-S03F4023V | RES SMD 402K OHM 1% 1/10W 0603 | datasheet.pdf | |
![]() | EMM08DRYI | CONN EDGECARD 16POS DIP .156 SLD | datasheet.pdf | |
![]() | KTF101B335K43N0T00 | CAP CER 3.3UF 100V X7R 1812 | datasheet.pdf | |
![]() | SCPH73B-390 | FIXED IND 39UH 1.16A 310 MOHM | datasheet.pdf | |
![]() | RWR81S2R74FSBSL | RES 2.74 OHM 1W 1% WW AXIAL | datasheet.pdf | |
![]() | RN55D1651FR36 | RES 1.65K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | M39003/09-2003/TR | CAP TANT 150UF 20% 6V AXIAL | datasheet.pdf | |
![]() | CMF601K2100FHEK | RES 1.21K OHM 1W 1% AXIAL | datasheet.pdf | |
![]() | MS3106E28-20SW | CONN PLUG 14POS INLINE W/SKTS | datasheet.pdf | |
![]() | 2-872050-2 | MQC-APPLICATOR/HD | datasheet.pdf | |
![]() | TXR54SJ00-2008AI | CONN BACKSHELL ADPT SZ 20 37 | datasheet.pdf | |
![]() | MS25043-14DA | RCPT COVER SHELL SIZE 14 ANODIZE | datasheet.pdf |