Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M2S100T-1FCG1152I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 24 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - System On Chip (SoC) | |
| Series | SmartFusion®2 | |
| Packaging | Tray | |
| Architecture | MCU, FPGA | |
| Core Processor | ARM® Cortex®-M3 | |
| MCU Flash | 512KB | |
| MCU RAM | 64KB | |
| Peripherals | DDR, PCIe, SERDES | |
| Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
| Speed | 166MHz | |
| Primary Attributes | FPGA - 100K Logic Modules | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 1152-BBGA, FCBGA | |
| Supplier Device Package | 1152-FCBGA (35x35) | |
| Number of I/O | 574 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M2S100T-1FCG1152I | |
| Related Links | M2S100T-, M2S100T-1FCG1152I Datasheet, Microsemi SoC Distributor | |
![]() | INA170EA/2K5G4 | IC CURRENT MONITOR 2% 8VSSOP | datasheet.pdf | |
![]() | LM5010MHX/NOPB | IC REG BUCK ADJ 1A 14TSSOP | datasheet.pdf | |
![]() | 4358PA51H01800 | GSKT FAB/FOAM 2.5X457.2MM DSHAPE | datasheet.pdf | |
![]() | NOIV1SN1300A-QDC | IC IMAGE SENSOR 1.3MP 48LCC | datasheet.pdf | |
![]() | 310000450905 | HERMETIC THERMOSTAT | datasheet.pdf | |
![]() | CMF606K8100BHEK | RES 6.81K OHM 1W 0.1% AXIAL | datasheet.pdf | |
![]() | 7201P3Y9V6BE | SWITCH TOGGLE DPDT 0.4VA 20V | datasheet.pdf | |
![]() | 84BB-0347-B | KEYPAD LEGEND TILE ALT | datasheet.pdf | |
![]() | CRT1206-FZ-4871ELF | RES SMD 4.87K OHM 1% 1/8W 1206 | datasheet.pdf | |
![]() | SIT9002AC-28H33SO | OSC MEMS PROG | datasheet.pdf | |
![]() | TV07DZ-25-187SA-LC | HD 38999 187C 187#23 SKT RECP | datasheet.pdf | |
![]() | BACC63BV24B61P8H | 26500 61C 61#20 P RECP SS LC | datasheet.pdf |