Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-M68DEMO908GB60E | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | Evaluation Boards - Embedded - MCU, DSP | |
| Series | HCS08 | |
| Board Type | Evaluation Platform | |
| Type | MCU 8-Bit | |
| Core Processor | HCS08 | |
| Operating System | - | |
| Platform | - | |
| For Use With/Related Products | MC9S08GB60 | |
| Mounting Type | Fixed | |
| Contents | Board(s), Cable(s), Accessories | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | M68DEMO908GB60E | |
| Related Links | M68DEMO, M68DEMO908GB60E Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
![]() | OD102JE | RES 1K OHM 1/4W 5% AXIAL | datasheet.pdf | |
![]() | RT0402CRE072K37L | RES SMD 2.37K OHM 1/16W 0402 | datasheet.pdf | |
![]() | SR151A500JAA | CAP CER 50PF 100V NP0 RADIAL | datasheet.pdf | |
![]() | ADP2121-1.875EVALZ | BOARD EVAL FOR ADP2121-1.875V | datasheet.pdf | |
![]() | RNC55H3161FMB14 | RES 3.16K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | 803-83-050-65-001101 | Connector Socket 50 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | UT00103W3PH | CONN HSG RCPT 6POS WALL MNT PIN | datasheet.pdf | |
![]() | ATS-01F-131-C2-R0 | HEATSINK 60X60X20MM XCUT T766 | datasheet.pdf | |
![]() | ATS-05D-76-C1-R0 | HEATSINK 25X25X25MM R-TAB | datasheet.pdf | |
![]() | RJE051AA1410 | CONN MOD JACK 10P10C R/A SHLD | datasheet.pdf | |
![]() | YE22015000J0G | 500 TB RIS CLA 2ND-LEVEL | datasheet.pdf | |
![]() | 97-3108A24-21SX-417-940 | AB 10C 9#16, 1#8 SKT PLUG | datasheet.pdf |