Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MC01YC331KAR | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 25 | |
| Category | Capacitors | |
| Family | Ceramic Capacitors | |
| Series | MC | |
| Packaging | Bulk | |
| Capacitance | 330pF | |
| Tolerance | ±10% | |
| Voltage - Rated | 16V | |
| Temperature Coefficient | X7R | |
| Mounting Type | Through Hole | |
| Operating Temperature | -55°C ~ 125°C | |
| Applications | General Purpose | |
| Ratings | - | |
| Package / Case | Radial | |
| Size / Dimension | 0.098" L x 0.051" W (2.50mm x 1.30mm) | |
| Height - Seated (Max) | 0.043" (1.10mm) | |
| Thickness (Max) | - | |
| Lead Spacing | 0.033" (0.83mm) | |
| Features | - | |
| Lead Style | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MC01YC331KAR | |
| Related Links | MC01YC, MC01YC331KAR Datasheet, AVX Corporation Distributor | |
![]() | CRCW20102M67FKEF | RES SMD 2.67M OHM 1% 3/4W 2010 | datasheet.pdf | |
![]() | TNPW0805536RBETA | RES SMD 536 OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | WISMC03BI | MODULE LAN 802.11B/G BISM | datasheet.pdf | |
![]() | ELM069200 | CONN TERM BLOCK 6POS 5.08MM VERT | datasheet.pdf | |
![]() | 0190290096 | DIE INSULATION INDENTOR | datasheet.pdf | |
![]() | 0554870819 | 2.0 WTB HEADER ASSY ST 8CKT | datasheet.pdf | |
![]() | 0298175.ZXEH-UL | FUSE MEGA 32V UL RATED 175A | datasheet.pdf | |
![]() | FMB05DYFR | CONN CARDEDGE DL 10POS .050 SMD | datasheet.pdf | |
![]() | 1715947 | TERM BLOCK | datasheet.pdf | |
![]() | ABC55DTKT | CONN EDGECARD 110POS .100" | datasheet.pdf | |
![]() | ATS-21A-59-C3-R0 | HEATSINK 35X35X30MM L-TAB T412 | datasheet.pdf | |
![]() | MGA-43013-BLKG | IC PA MODULE 728-756MHZ MCOB | datasheet.pdf |