NXP Semiconductors/Freescale Semiconductor, Inc. MC9S12DJ128CPVE
- Mfg. Part Number
- MC9S12DJ128CPVE
- Manufacturer
- NXP Semiconductors/Freescale Semiconductor, Inc.
- Product Category
- Embedded - Microcontrollers
- Brief Description
- IC MCU 16BIT 128KB FLASH 112LQFP
- Datasheet Download
- MC9S12DJ128CPVE.pdf
Availability of MC9S12DJ128CPVE
Available Quantity
6769 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- $ 12.91200
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of MC9S12DJ128CPVE, we specialize in NXP Semiconductors/Freescale Semiconductor, Inc. all series electronic components. MC9S12DJ128CPVE can be shipped within 24 hours after order. If you have any demands for MC9S12DJ128CPVE, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- MC9S12DJ128CPVE Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
MC9S12DJ128CPVE
| Internal Part Number | EIS-MC9S12DJ128CPVE | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | Copper Wire Conversion 20/May/2014 | |
| Standard Package | 300 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | HCS12 | |
| Packaging | Tray | |
| Core Processor | HCS12 | |
| Core Size | 16-Bit | |
| Speed | 25MHz | |
| Connectivity | CAN, I²C, SCI, SPI | |
| Peripherals | PWM, WDT | |
| Number of I/O | 91 | |
| Program Memory Size | 128KB (128K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 2K x 8 | |
| RAM Size | 8K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 2.35 V ~ 5.25 V | |
| Data Converters | A/D 16x10b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 112-LQFP | |
| Supplier Device Package | 112-LQFP (20x20) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MC9S12DJ128CPVE | |
| Related Links | MC9S12D, MC9S12DJ128CPVE Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
MC9S12DJ128CPVE Details Description
Related parts for MC9S12DJ128CPVE
 | 801-43-031-10-001000 | Connector Receptacle 31 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
 | RBM12DTBH-S189 | CONN EDGECARD 24POS R/A .156 SLD | datasheet.pdf | |
.jpg) | KTR10EZPJ100 | RES SMD 10 OHM 5% 1/8W 0805 | datasheet.pdf | |
 | D3V-16114-1C25-K | SWITCH LEVER SPDT 16A QC TERM | datasheet.pdf | |
 | TRF4900PWR | IC SINGLE-CHIP RF XMIT 24-TSSOP | datasheet.pdf | |
| PVC1156 | CAP FILM 0.056UF 10% 100VDC RAD | datasheet.pdf | |
 | P6KE24HE3/54 | TVS DIODE 19.4VWM 34.7VC DO204AC | datasheet.pdf | |
 | ECS-143-20-3X-TR | Crystal 14.31818MHz 30ppm 20pF 60 Ohm -10°C - 70°C Surface Mount HC49/US | datasheet.pdf | |
| 1905625 | TERM BLOCK | datasheet.pdf | |
| ATS-10B-146-C2-R0 | HEATSINK 30X30X35MM L-TAB T766 | datasheet.pdf | |
| ATS-12E-31-C2-R0 | HEATSINK 57.9X36.83X5.84MM T766 | datasheet.pdf | |
| MKP1841256106 | CAP FILM 5.6 NF 20% 1000VDC | datasheet.pdf |