Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCIMX233DAG4C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | MCIMX233 Leadframe Mold Compound 24/Sep/2014 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 630 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microprocessors | |
| Series | i.MX23 | |
| Packaging | Tray | |
| Core Processor | ARM926EJ-S | |
| Number of Cores/Bus Width | 1 Core, 32-Bit | |
| Speed | 454MHz | |
| Co-Processors/DSP | Data; DCP | |
| RAM Controllers | DRAM | |
| Graphics Acceleration | No | |
| Display & Interface Controllers | LCD, Touchscreen | |
| Ethernet | - | |
| SATA | - | |
| USB | USB 2.0 + PHY (1) | |
| Voltage - I/O | 2.0V, 2.5V, 2.7V, 3.0V, 3.3V | |
| Operating Temperature | -10°C ~ 70°C | |
| Security Features | Cryptography, Hardware ID | |
| Package / Case | 128-LQFP | |
| Supplier Device Package | * | |
| Additional Interfaces | I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCIMX233DAG4C | |
| Related Links | MCIMX2, MCIMX233DAG4C Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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