Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MCIMX6S4AVM08AB | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | i.MX 6 Series Applications Processors Introduction | |
PCN Design/Specification | I.MX 6SOLO6DUALLITE Errata Update 11/Dec/2013 i.MX6DL/S Rev1.2 Release 30/Jan/2014 I.MX6 Datasheet Update 06/May/2014 Errata Update 06/Aug/2014 Maskset Updates 15/Jan/2015 Masket Revision A 11/Mar/2015 Reference Manual Update 27/May/2015 Datasheet Update 01/Jul/2015 Silicon Update 10/Sep/2015 Silicon Revision B 22/Sep/2015 | |
PCN Assembly/Origin | Additional Test Site 14/May/2014 iMX6 Assembly Site Add 29/Sep/2015 iMX6 Assembly Site Add Rev 23/Oct/2015 | |
Standard Package | 300 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microprocessors | |
Series | i.MX6S | |
Packaging | Tray | |
Core Processor | ARM® Cortex®-A9 | |
Number of Cores/Bus Width | 1 Core, 32-Bit | |
Speed | 800MHz | |
Co-Processors/DSP | Multimedia; NEON™ SIMD | |
RAM Controllers | LPDDR2, LVDDR3, DDR3 | |
Graphics Acceleration | Yes | |
Display & Interface Controllers | Keypad, LCD | |
Ethernet | 10/100/1000 Mbps (1) | |
SATA | - | |
USB | USB 2.0 + PHY (4) | |
Voltage - I/O | 1.8V, 2.5V, 2.8V, 3.3V | |
Operating Temperature | -40°C ~ 125°C | |
Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | |
Package / Case | 624-LFBGA | |
Supplier Device Package | * | |
Additional Interfaces | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MCIMX6S4AVM08AB | |
Related Links | MCIMX6S, MCIMX6S4AVM08AB Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor |
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