Microchip Technology MCP23S08-E/ML

MCP23S08-E/ML picture photo
Mfg. Part Number
MCP23S08-E/ML
Manufacturer
Product Category
Interface - I/O Expanders
Brief Description
IC I/O EXPANDER SPI 8B 20QFN
Datasheet Download
MCP23S08-E/ML.pdf
Availability of MCP23S08-E/ML

Available Quantity

7032 Pieces

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Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
$ 0.87000
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of MCP23S08-E/ML, we specialize in Microchip Technology all series electronic components. MCP23S08-E/ML can be shipped within 24 hours after order. If you have any demands for MCP23S08-E/ML, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
MCP23S08-E/ML Order Process
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Specifications of MCP23S08-E/ML
Internal Part NumberEIS-MCP23S08-E/ML
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)1 (Unlimited)
Production Status (Lifecycle)In Production
ConditionNew & Unused, Original Sealed
Reference Design LibraryGPIODM-KPLCD: 8/16-Bit GPIO Exp, 4x4 Keypad, LCD
PCN Design/SpecificationLead Frame Update 16/Feb/2015
PCN Assembly/OriginQualification QFN-28,20,16 Packages 26/Dec/2013
Qualification QFN-28,20,16 with Copper 09/Jan/2014
Qualification Report 28/Jan/2014
Qualification Copper Wire Revison 01/Apr/2014
Cancelation of Copper Assembly 25/Jun/2015
PCN PackagingLabel and Packing Changes 23/Sep/2015
Standard Package91
Category Integrated Circuits (ICs)
FamilyInterface - I/O Expanders
Series-
PackagingTray
Number of I/O8
InterfaceSPI
Interrupt OutputYes
FeaturesPOR
Output TypePush-Pull
Current - Output Source/Sink25mA
Frequency - Clock10MHz
Voltage - Supply1.8 V ~ 5.5 V
Operating Temperature-40°C ~ 125°C
Mounting TypeSurface Mount
Package / Case20-VFQFN Exposed Pad
Supplier Device Package20-QFN-EP (4x4)
Weight0.001 KG
ApplicationEmail for details
Alternative Part (Replacement)MCP23S08-E/ML
Related LinksMCP23S, MCP23S08-E/ML Datasheet, Microchip Technology Distributor
MCP23S08-E/ML Details Description
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