Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCP23S17-E/SS | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | GPIO Expanders | |
| PCN Design/Specification | Copper Bond Wire 17/Dec/2014 | |
| PCN Assembly/Origin | Mold Compound Update 30/Jul/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 47 | |
| Category | Integrated Circuits (ICs) | |
| Family | Interface - I/O Expanders | |
| Series | - | |
| Packaging | Tube | |
| Number of I/O | 16 | |
| Interface | SPI | |
| Interrupt Output | Yes | |
| Features | POR | |
| Output Type | Push-Pull | |
| Current - Output Source/Sink | 25mA | |
| Frequency - Clock | 10MHz | |
| Voltage - Supply | 1.8 V ~ 5.5 V | |
| Operating Temperature | -40°C ~ 125°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 28-SSOP (0.209", 5.30mm Width) | |
| Supplier Device Package | 28-SSOP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCP23S17-E/SS | |
| Related Links | MCP23S, MCP23S17-E/SS Datasheet, Microchip Technology Distributor | |
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