Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCP3301T-BI/SN | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | SOIC-8L Copper Bond Wire 18/Sep/2013 SOIC-8L Copper Bond Wire 18/Dec/2013 | |
| PCN Assembly/Origin | SOIC-8L Copper Bond Wire Revision 06/Feb/2014 Assembly Site Addition 08/Apr/2015 Assembly Site Addition 08/Apr/2015 | |
| PCN Packaging | Reel Design Update 07/May/2015 Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 3,300 | |
| Category | Integrated Circuits (ICs) | |
| Family | Data Acquisition - Analog to Digital Converters (ADC) | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Number of Bits | 13 | |
| Sampling Rate (Per Second) | 100k | |
| Number of Inputs | 1 | |
| Input Type | Differential | |
| Data Interface | SPI | |
| Configuration | S/H-ADC | |
| Ratio - S/H:ADC | 1:1 | |
| Number of A/D Converters | 1 | |
| Architecture | SAR | |
| Reference Type | External | |
| Voltage - Supply, Analog | 5V | |
| Voltage - Supply, Digital | 5V | |
| Features | - | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
| Supplier Device Package | 8-SOIC N | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCP3301T-BI/SN | |
| Related Links | MCP3301, MCP3301T-BI/SN Datasheet, Microchip Technology Distributor | |
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