Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCP606-I/P | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Assembly/Origin | Qualification Revision 23/Aug/2013 Qualification SPDIP-28L, PDIP-8/16L 18/Sep/2013 Qualification Revision 18/Dec/2013 Qualification Revision 06/Feb/2014 Qualification Copper Wire 17/Mar/2014 Qualification Copper Bond Wire 17/Jun/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
| Series | - | |
| Packaging | Tube | |
| Amplifier Type | General Purpose | |
| Number of Circuits | 1 | |
| Output Type | Rail-to-Rail | |
| Slew Rate | 0.08 V/µs | |
| Gain Bandwidth Product | 155kHz | |
| -3db Bandwidth | - | |
| Current - Input Bias | 1pA | |
| Voltage - Input Offset | 250µV | |
| Current - Supply | 18.7µA | |
| Current - Output / Channel | 17mA | |
| Voltage - Supply, Single/Dual (±) | 2.5 V ~ 6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Mounting Type | Through Hole | |
| Package / Case | 8-DIP (0.300", 7.62mm) | |
| Supplier Device Package | 8-PDIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCP606-I/P | |
| Related Links | MCP60, MCP606-I/P Datasheet, Microchip Technology Distributor | |
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