Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCP6482T-E/MNY | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Mold Compound Update 18/Feb/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| PCN Other | CuPdAu Bond Wire 24/Apr/2015 | |
| Standard Package | 3,300 | |
| Category | Integrated Circuits (ICs) | |
| Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Amplifier Type | General Purpose | |
| Number of Circuits | 2 | |
| Output Type | Rail-to-Rail | |
| Slew Rate | 2.7 V/µs | |
| Gain Bandwidth Product | 4MHz | |
| -3db Bandwidth | - | |
| Current - Input Bias | 1pA | |
| Voltage - Input Offset | 1.5mV | |
| Current - Supply | 240µA | |
| Current - Output / Channel | 12mA | |
| Voltage - Supply, Single/Dual (±) | 2.2 V ~ 5.5 V, ±1.1 V ~ 2.75 V | |
| Operating Temperature | -40°C ~ 125°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-WFDFN Exposed Pad | |
| Supplier Device Package | 8-TDFN (2x3) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCP6482T-E/MNY | |
| Related Links | MCP6482, MCP6482T-E/MNY Datasheet, Microchip Technology Distributor | |
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