Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MCP6S26T-I/SL | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Reference Design Library | TMPSNS-RTD1: 2, 3, or 4-wire RTD Sensor Interface | |
PCN Design/Specification | Copper Bond Wire 09/Mar/2015 Copper Bond Wire 5/Nov/2015 | |
PCN Assembly/Origin | Qualification Copper Bond Wire 31/Oct/2014 | |
PCN Packaging | Reel Design Update 07/May/2015 Label and Packing Changes 23/Sep/2015 | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 2,600 | |
Category | Integrated Circuits (ICs) | |
Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
Series | - | |
Packaging | Tape & Reel (TR) | |
Amplifier Type | Programmable Gain | |
Number of Circuits | 6 | |
Output Type | Push-Pull, Rail-to-Rail | |
Slew Rate | 22 V/µs | |
Gain Bandwidth Product | - | |
-3db Bandwidth | 12MHz | |
Current - Input Bias | 1pA | |
Voltage - Input Offset | 275µV | |
Current - Supply | 1mA | |
Current - Output / Channel | 30mA | |
Voltage - Supply, Single/Dual (±) | 2.5 V ~ 5.5 V | |
Operating Temperature | -40°C ~ 85°C | |
Mounting Type | Surface Mount | |
Package / Case | 14-SOIC (0.154", 3.90mm Width) | |
Supplier Device Package | 14-SOIC | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MCP6S26T-I/SL | |
Related Links | MCP6S2, MCP6S26T-I/SL Datasheet, Microchip Technology Distributor |
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