Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCP98242T-CE/MNY | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | EMC1501/MCP98242 Devices 03/Apr/2014 | |
| PCN Design/Specification | Mold Compound Update 18/Feb/2015 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| PCN Other | CuPdAu Bond Wire 24/Apr/2015 | |
| Standard Package | 3,300 | |
| Category | Integrated Circuits (ICs) | |
| Family | PMIC - Thermal Management | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Function | Temp Monitoring System (Sensor), DIMM DDR Memory | |
| Sensor Type | Internal | |
| Sensing Temperature | -40°C ~ 125°C | |
| Accuracy | ±3°C(Max) | |
| Topology | ADC (Sigma Delta), Register Bank | |
| Output Type | I²C/SMBus | |
| Output Alarm | Yes | |
| Output Fan | Yes | |
| Voltage - Supply | 3 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 125°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-WFDFN Exposed Pad | |
| Supplier Device Package | 8-TDFN (2x3) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCP98242T-CE/MNY | |
| Related Links | MCP98242, MCP98242T-CE/MNY Datasheet, Microchip Technology Distributor | |
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