Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCR03EZPJ132 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 5,000 | |
| Category | Resistors | |
| Family | Chip Resistor - Surface Mount | |
| Series | MCR | |
| Packaging | Tape & Reel (TR) | |
| Resistance (Ohms) | 1.3k | |
| Tolerance | ±5% | |
| Power (Watts) | 0.1W, 1/10W | |
| Composition | Thick Film | |
| Features | - | |
| Temperature Coefficient | ±200ppm/°C | |
| Operating Temperature | -55°C ~ 155°C | |
| Package / Case | 0603 (1608 Metric) | |
| Supplier Device Package | 0603 (1608 Metric) | |
| Size / Dimension | 0.063" L x 0.031" W (1.60mm x 0.80mm) | |
| Height | 0.022" (0.55mm) | |
| Number of Terminations | 2 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCR03EZPJ132 | |
| Related Links | MCR03E, MCR03EZPJ132 Datasheet, Rohm Semiconductor Distributor | |
![]() | ECQ-E6273KF | CAP FILM 0.027UF 10% 630VDC RAD | datasheet.pdf | |
![]() | XCV800-4FG676C | IC FPGA 444 I/O 676FBGA | datasheet.pdf | |
![]() | RJ11-6LCT1-B | CONN MOD JACK 6P6C R/A SHIELDED | datasheet.pdf | |
![]() | HM2P07PDF1M0N9 | CONN HEADER 110POS TYPE A VERT | datasheet.pdf | |
![]() | 284519-5 | TERM BLOCK HDR 5POS VERT 3.81MM | datasheet.pdf | |
![]() | RS-1205S/H2 | CONV DC/DC 2W 9-18VIN 05VOUT | datasheet.pdf | |
![]() | PLTT0805Z5421QGT5 | RES SMD 5.42KOHM 0.02% 1/4W 0805 | datasheet.pdf | |
![]() | B32774D4106J | CAP FILM 10UF 5% 450VDC RADIAL | datasheet.pdf | |
![]() | 1861222 | PLUG 7.62 MM 9POS DIRECT MOUNT | datasheet.pdf | |
![]() | 929715-11-15-EU | CONN HEADER 30POS DUAL .100 STR | datasheet.pdf | |
![]() | IRAUDAMP9 | BOARD EVAL FOR IRS2092S | datasheet.pdf | |
![]() | ATS-11F-191-C2-R0 | HEATSINK 45X45X30MM R-TAB T766 | datasheet.pdf |