Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCR10EZHFLR200 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 5,000 | |
| Category | Resistors | |
| Family | Chip Resistor - Surface Mount | |
| Series | MCR | |
| Packaging | Tape & Reel (TR) | |
| Resistance (Ohms) | 0.2 | |
| Tolerance | ±1% | |
| Power (Watts) | 0.25W, 1/4W | |
| Composition | Thick Film | |
| Features | - | |
| Temperature Coefficient | ±250ppm/°C | |
| Operating Temperature | -55°C ~ 155°C | |
| Package / Case | 0805 (2012 Metric) | |
| Supplier Device Package | 0805 (2012 Metric) | |
| Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) | |
| Height | 0.024" (0.60mm) | |
| Number of Terminations | 2 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCR10EZHFLR200 | |
| Related Links | MCR10EZ, MCR10EZHFLR200 Datasheet, Rohm Semiconductor Distributor | |
![]() | 3760-9 | BINDING POST TIN PLATED WHITE | datasheet.pdf | |
![]() | 1010980000 | TERM BLOCK DIN 10X3 BSBR WM BU | datasheet.pdf | |
![]() | PIC16F631T-I/ML | IC MCU 8BIT 1.75KB FLASH 20QFN | datasheet.pdf | |
![]() | EBM43DCWS | CONN EDGECARD 86POS DIP .156 SLD | datasheet.pdf | |
![]() | TPS61071TDDCRQ1 | IC REG BOOST ADJ 455MA SYNC SOT6 | datasheet.pdf | |
![]() | 74007-3618 | UMY5-3618 SAFETY MAT | datasheet.pdf | |
![]() | 40166-0042 | SAFETY MAT 750X1750MM | datasheet.pdf | |
![]() | D4SL-N4QDG-D4N | D4SL-N4QDG-D4N | datasheet.pdf | |
![]() | ECW-FD2W184KQ | CAP FILM 0.18UF 10% 450VDC RAD | datasheet.pdf | |
| IS42S86400F-7TL-TR | IC SDRAM 512MB 143MHZ 54TSOP | datasheet.pdf | ||
![]() | TVPS00RF-25-8PC | TV 8C 8#8(TWIN) PIN RECP | datasheet.pdf | |
![]() | C48-16R10-2P7-106 | 26500 2C 2#20 PIN PLUG | datasheet.pdf |