Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCR10EZHJ752 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 5,000 | |
| Category | Resistors | |
| Family | Chip Resistor - Surface Mount | |
| Series | MCR | |
| Packaging | Tape & Reel (TR) | |
| Resistance (Ohms) | 7.5k | |
| Tolerance | ±5% | |
| Power (Watts) | 0.125W, 1/8W | |
| Composition | Thick Film | |
| Features | - | |
| Temperature Coefficient | ±200ppm/°C | |
| Operating Temperature | -55°C ~ 155°C | |
| Package / Case | 0805 (2012 Metric) | |
| Supplier Device Package | 0805 (2012 Metric) | |
| Size / Dimension | 0.079" L x 0.049" W (2.00mm x 1.25mm) | |
| Height | 0.024" (0.60mm) | |
| Number of Terminations | 2 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCR10EZHJ752 | |
| Related Links | MCR10E, MCR10EZHJ752 Datasheet, Rohm Semiconductor Distributor | |
![]() | RSM31DTMD | CONN EDGECARD 62POS R/A .156 SLD | datasheet.pdf | |
![]() | 6038BG | BOARD LEVEL HEAT SINK | datasheet.pdf | |
![]() | EET-HC2S331JA | CAP ALUM 330UF 20% 420V SNAP | datasheet.pdf | |
![]() | DEMA9PA183F0 | DSUB 9 M CRIMP G A183 | datasheet.pdf | |
![]() | VE-27N-IX-F3 | CONVERTER MOD DC/DC 18.5V 75W | datasheet.pdf | |
![]() | RNC60K5622FSB14 | RES 56.2K OHM 1/4W 1% AXIAL | datasheet.pdf | |
![]() | BD899A-S | TRANS NPN DARL 80V 8A | datasheet.pdf | |
![]() | ALD212900APAL | MOSFET 2N-CH 10.6V 0.08A 8DIP | datasheet.pdf | |
![]() | ECC15DKJI | CONN EDGECARD 30POS .100" | datasheet.pdf | |
![]() | CC0603KRX5R5BB106 | CAP CER 10UF 6.3V X5R 0603 | datasheet.pdf | |
![]() | CXA3590-0000-000N00AB27G | LED COB CXA3590 2700K WHT SMD | datasheet.pdf | |
![]() | SAFCC1G74KA0T00BOS | Capacitors Inductors Filters... | datasheet.pdf |