Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MCR50JZHF3570 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 4,000 | |
| Category | Resistors | |
| Family | Chip Resistor - Surface Mount | |
| Series | MCR | |
| Packaging | Tape & Reel (TR) | |
| Resistance (Ohms) | 357 | |
| Tolerance | ±1% | |
| Power (Watts) | 0.5W, 1/2W | |
| Composition | Thick Film | |
| Features | - | |
| Temperature Coefficient | ±100ppm/°C | |
| Operating Temperature | -55°C ~ 155°C | |
| Package / Case | 2010 (5025 Metric) | |
| Supplier Device Package | 2010 (5025 Metric) | |
| Size / Dimension | 0.197" L x 0.098" W (5.00mm x 2.50mm) | |
| Height | 0.028" (0.70mm) | |
| Number of Terminations | 2 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MCR50JZHF3570 | |
| Related Links | MCR50J, MCR50JZHF3570 Datasheet, Rohm Semiconductor Distributor | |
![]() | ESM10DWWN | CONN EDGECARD 20POS .156 SQ WW | datasheet.pdf | |
![]() | TLV5618ACPE4 | IC DAC 12BIT SERIAL DUAL 8-DIP | datasheet.pdf | |
![]() | TVP9900PFPR | IC VSB/QAM RCVR 80HTQFP | datasheet.pdf | |
![]() | XK-Z11-EBP | XBEE DEVELOPMENT KIT | datasheet.pdf | |
![]() | RCL06121R82FKEA | RES SMD 1.82 OHM 1/2W 1206 WIDE | datasheet.pdf | |
![]() | RCL06129R76FKEA | RES SMD 9.76 OHM 1/2W 1206 WIDE | datasheet.pdf | |
![]() | R99-11 FOR MY(NAMEPLATE) | NAMEPLATE FOR MY | datasheet.pdf | |
![]() | VI-B0J-CY-F1 | CONVERTER MOD DC/DC 36V 50W | datasheet.pdf | |
![]() | RC1005F223CS | RES SMD 22K OHM 1% 1/16W 0402 | datasheet.pdf | |
![]() | ATS-11F-58-C2-R0 | HEATSINK 35X35X25MM L-TAB T766 | datasheet.pdf | |
![]() | ATS-12G-99-C1-R0 | HEATSINK 45X45X20MM R-TAB | datasheet.pdf | |
![]() | ATS-05D-104-C1-R1 | HEATSINK 40X40X12.7MM XCUT | datasheet.pdf |