Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MK51DN256ZCMD10 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| PCN Design/Specification | KINETIS K, L, COLDFIRE+ Errata Update 17/Oct/2013 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | Kinetis K50 | |
| Packaging | Tray | |
| Core Processor | ARM® Cortex®-M4 | |
| Core Size | 32-Bit | |
| Speed | 100MHz | |
| Connectivity | EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | |
| Peripherals | DMA, I²S, LCD, LVD, POR, PWM, WDT | |
| Number of I/O | 94 | |
| Program Memory Size | 256KB (256K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 64K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.71 V ~ 3.6 V | |
| Data Converters | A/D 41x16b, D/A 2x12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 144-LBGA | |
| Supplier Device Package | 144-MAPBGA (13x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MK51DN256ZCMD10 | |
| Related Links | MK51DN2, MK51DN256ZCMD10 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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