Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MKP383224200JC02Z0 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Mfg Application Notes | Soldering Guidelines Appl Note Voltage Proof Test Appl Note | |
| Standard Package | 550 | |
| Category | Capacitors | |
| Family | Film Capacitors | |
| Series | MMKP383 | |
| Packaging | * | |
| Capacitance | 2400pF | |
| Tolerance | ±5% | |
| Voltage Rating - AC | 700V | |
| Voltage Rating - DC | 2000V (2kV) | |
| Dielectric Material | Polypropylene (PP), Metallized | |
| ESR (Equivalent Series Resistance) | - | |
| Operating Temperature | -55°C ~ 105°C | |
| Mounting Type | * | |
| Package / Case | * | |
| Size / Dimension | * | |
| Height - Seated (Max) | * | |
| Termination | * | |
| Lead Spacing | * | |
| Applications | General Purpose | |
| Features | - | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MKP383224200JC02Z0 | |
| Related Links | MKP383224, MKP383224200JC02Z0 Datasheet, Vishay/BCcomponents Distributor | |
![]() | TDH35P3R00JE | RES SMD 3 OHM 5% 35W DPAK | datasheet.pdf | |
![]() | 929400-01-08-RK | CONN HEADER .100 SNGL STR 8POS | datasheet.pdf | |
![]() | BB-75.000MBE-T | OSC XO 75.000MHZ LVPECL SMD | datasheet.pdf | |
![]() | 0638133502 | EXTRACTION TOOL FOR COEDGE RIVET | datasheet.pdf | |
![]() | 3455R82980049 | PHENOLIC AUTO RESET THERMOSTAT | datasheet.pdf | |
![]() | ECC70DRMD-S288 | CONN EDGECARD 140POS .100" | datasheet.pdf | |
![]() | ATS-10G-157-C2-R0 | HEATSINK 40X40X30MM L-TAB T766 | datasheet.pdf | |
![]() | 466751-1 | HDM EMPR180F180FK | datasheet.pdf | |
![]() | NCV8154MW300300TBG | IC REG LDO 3V/3V 0.3A XDFN6 | datasheet.pdf | |
![]() | MS3108A22-8P-RES | ER 2C 2#12 PIN PLUG | datasheet.pdf | |
![]() | ADR365B | Low Power, Low Noise Voltage References with Sink/Source Capability IC | datasheet.pdf | |
![]() | LDB184G5010C-110 | Chip Multilayer Hybrid Baluns | datasheet.pdf |