Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MKP383347100JFM2B0 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Mfg Application Notes | Soldering Guidelines Appl Note Voltage Proof Test Appl Note | |
Standard Package | 750 | |
Category | Capacitors | |
Family | Film Capacitors | |
Series | MMKP383 | |
Packaging | * | |
Capacitance | 0.047µF | |
Tolerance | ±5% | |
Voltage Rating - AC | 350V | |
Voltage Rating - DC | 1000V (1kV) | |
Dielectric Material | Polypropylene (PP), Metallized | |
ESR (Equivalent Series Resistance) | - | |
Operating Temperature | -55°C ~ 105°C | |
Mounting Type | * | |
Package / Case | * | |
Size / Dimension | * | |
Height - Seated (Max) | * | |
Termination | * | |
Lead Spacing | * | |
Applications | General Purpose | |
Features | - | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MKP383347100JFM2B0 | |
Related Links | MKP383347, MKP383347100JFM2B0 Datasheet, Vishay/BCcomponents Distributor |
![]() | 766163273G | RES ARRAY 8 RES 27K OHM 16SOIC | datasheet.pdf | |
![]() | TPS2042D | IC DUAL POWER DIST SW 8-SOIC | datasheet.pdf | |
![]() | LTC2051HVCDD#TRPBF | IC OPAMP CHOPPER 3MHZ RRO 8DFN | datasheet.pdf | |
![]() | FMC20DRXS | CONN EDGECARD 40POS DIP .100 SLD | datasheet.pdf | |
![]() | ECS-73-18-4XEN | Crystal 7.3728MHz 30ppm 18pF 80 Ohm -40°C - 85°C Through Hole HC49/US | datasheet.pdf | |
![]() | M39003/01-2270 | CAP TANT 18UF 10% 15V AXIAL | datasheet.pdf | |
![]() | 64991-G17-4R | CONN HEADER | datasheet.pdf | |
![]() | ATS-01F-149-C2-R0 | HEATSINK 35X35X20MM L-TAB T766 | datasheet.pdf | |
![]() | XF3M-2515-1B | CONN FFC FPC 25POS 0.50MM R/A | datasheet.pdf | |
![]() | T714035100J0G | 635 TB RISING CLAMP 45D | datasheet.pdf | |
![]() | XACG-M365E | FP SIGMA POSITIONING MANUAL | datasheet.pdf | |
![]() | EP7309-CV-C | HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE IC | datasheet.pdf |