Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MM912F634DV2AP | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Bond Wire 14/May/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 1,250 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers - Application Specific | |
| Series | - | |
| Packaging | Tray | |
| Applications | Automotive | |
| Core Processor | S12 | |
| Program Memory Type | FLASH (32 KB) | |
| Controller Series | HCS12 | |
| RAM Size | 2K x 8 | |
| Interface | LIN, SCI | |
| Number of I/O | 9 | |
| Voltage - Supply | 2.25 V ~ 5.5 V | |
| Operating Temperature | -40°C ~ 105°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 48-LQFP | |
| Supplier Device Package | 48-LQFP (7x7) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MM912F634DV2AP | |
| Related Links | MM912F6, MM912F634DV2AP Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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