Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MMF25SBRD390R | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 3,000 | |
| Category | Resistors | |
| Family | Chip Resistor - Surface Mount | |
| Series | MMF | |
| Packaging | Tape & Reel (TR) | |
| Resistance (Ohms) | 390 | |
| Tolerance | ±0.1% | |
| Power (Watts) | 0.25W, 1/4W | |
| Composition | Metal Film | |
| Features | - | |
| Temperature Coefficient | ±25ppm/°C | |
| Operating Temperature | -55°C ~ 155°C | |
| Package / Case | MELF, 0204 | |
| Supplier Device Package | MELF | |
| Size / Dimension | 0.055" Dia x 0.138" L (1.40mm x 3.50mm) | |
| Height | - | |
| Number of Terminations | 2 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MMF25SBRD390R | |
| Related Links | MMF25S, MMF25SBRD390R Datasheet, Yageo Distributor | |
![]() | 103-183K | FIXED IND 18UH 130MA 5.8 OHM SMD | datasheet.pdf | |
![]() | RG1608P-1650-C-T5 | RES SMD 165 OHM 0.25% 1/10W 0603 | datasheet.pdf | |
![]() | ACC630U30 | RELAY CONTACTOR 60A | datasheet.pdf | |
![]() | VJ1808Y682JXEAT5Z | CAP CER 6800PF 500V X7R 1808 | datasheet.pdf | |
![]() | 179-037-313R491 | D-Sub Connector Plug, Male Pins; Receptacle, Female Sockets 37, 37 Position Through Hole, Right Angle Solder | datasheet.pdf | |
| IS42S32200E-7TL | IC SDRAM 64MBIT 143MHZ 86TSOP | datasheet.pdf | ||
![]() | DF37B-20DP-0.4V(51) | CONN HDR 20POS 0.4MM SMD GOLD | datasheet.pdf | |
![]() | LKX2D102MESC30 | CAP ALUM 1000UF 20% 200V SNAP | datasheet.pdf | |
![]() | 431700-20-0 | Connector Barrier Block Strip 20 Circuit 0.438" (11.12mm) | datasheet.pdf | |
![]() | 10980000030 | HAN-FAPC LOCK PROMOTION BOX | datasheet.pdf | |
![]() | 20020108-G181A01LF | TERM BLOCK | datasheet.pdf | |
![]() | EP7312-CR-C | HIGH-PERFORMANCE, LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE IC | datasheet.pdf |