Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MPC8306VMABDCA | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | MPC830x Series Overview | |
| PCN Design/Specification | MPC830x MAPBGA Family Wire 29/May/2013 8306/09 Families Datasheet Update 11/Jul/2013 MPC8306,8,9 Signal Updates 15/Dec/2014 Errata Update 03/Sep/2015 | |
| Standard Package | 336 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microprocessors | |
| Series | MPC83xx | |
| Packaging | Tray | |
| Core Processor | PowerPC e300c3 | |
| Number of Cores/Bus Width | 1 Core, 32-Bit | |
| Speed | 133MHz | |
| Co-Processors/DSP | Communications; QUICC Engine | |
| RAM Controllers | DDR2 | |
| Graphics Acceleration | No | |
| Display & Interface Controllers | - | |
| Ethernet | 10/100 Mbps (3) | |
| SATA | - | |
| USB | USB 2.0 (1) | |
| Voltage - I/O | 1.8V, 3.3V | |
| Operating Temperature | 0°C ~ 105°C | |
| Security Features | - | |
| Package / Case | 369-LFBGA | |
| Supplier Device Package | 369-PBGA (19x19) | |
| Additional Interfaces | CAN, DUART, I²C, MMC/SD, SPI, TDM | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MPC8306VMABDCA | |
| Related Links | MPC8306, MPC8306VMABDCA Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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