Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MPC8313ECZQAFFC | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Errata Update 18/Jun/2014 MPC8313 Copper Bond Wire 03/Jul/2014 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microprocessors | |
| Series | MPC83xx | |
| Packaging | Tray | |
| Core Processor | PowerPC e300c3 | |
| Number of Cores/Bus Width | 1 Core, 32-Bit | |
| Speed | 333MHz | |
| Co-Processors/DSP | Security; SEC 2.2 | |
| RAM Controllers | DDR, DDR2 | |
| Graphics Acceleration | No | |
| Display & Interface Controllers | - | |
| Ethernet | 10/100/1000 Mbps (2) | |
| SATA | - | |
| USB | USB 2.0 + PHY (1) | |
| Voltage - I/O | 1.8V, 2.5V, 3.3V | |
| Operating Temperature | -40°C ~ 105°C | |
| Security Features | Cryptography | |
| Package / Case | 516-BBGA Exposed Pad | |
| Supplier Device Package | 516-TEPBGA (27x27) | |
| Additional Interfaces | DUART, HSSI, I²C, PCI, SPI | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MPC8313ECZQAFFC | |
| Related Links | MPC8313, MPC8313ECZQAFFC Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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