Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MPC8313ZQADDC | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Errata Update 18/Jun/2014 MPC8313 Copper Bond Wire 03/Jul/2014 | |
Standard Package | 240 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microprocessors | |
Series | MPC83xx | |
Packaging | Tray | |
Core Processor | PowerPC e300c3 | |
Number of Cores/Bus Width | 1 Core, 32-Bit | |
Speed | 267MHz | |
Co-Processors/DSP | - | |
RAM Controllers | DDR, DDR2 | |
Graphics Acceleration | No | |
Display & Interface Controllers | - | |
Ethernet | 10/100/1000 Mbps (2) | |
SATA | - | |
USB | USB 2.0 + PHY (1) | |
Voltage - I/O | 1.8V, 2.5V, 3.3V | |
Operating Temperature | 0°C ~ 105°C | |
Security Features | - | |
Package / Case | 516-BBGA Exposed Pad | |
Supplier Device Package | 516-TEPBGA (27x27) | |
Additional Interfaces | DUART, HSSI, I²C, PCI, SPI | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MPC8313ZQADDC | |
Related Links | MPC831, MPC8313ZQADDC Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor |
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