Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MPC855TZQ50D4R2 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Bond Update 01/Aug/2014 | |
| Standard Package | 180 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microprocessors | |
| Series | MPC8xx | |
| Packaging | Tape & Reel (TR) | |
| Core Processor | MPC8xx | |
| Number of Cores/Bus Width | 1 Core, 32-Bit | |
| Speed | 50MHz | |
| Co-Processors/DSP | Communications; CPM | |
| RAM Controllers | DRAM | |
| Graphics Acceleration | No | |
| Display & Interface Controllers | - | |
| Ethernet | 10 Mbps (1), 10/100 Mbps (1) | |
| SATA | - | |
| USB | - | |
| Voltage - I/O | 3.3V | |
| Operating Temperature | 0°C ~ 95°C | |
| Security Features | - | |
| Package / Case | 357-BBGA | |
| Supplier Device Package | 357-PBGA (25x25) | |
| Additional Interfaces | HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MPC855TZQ50D4R2 | |
| Related Links | MPC855T, MPC855TZQ50D4R2 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
![]() | ML4821CP | IC CONTROLLER PWM BOOST 18DIP | datasheet.pdf | |
![]() | 406C35B22M00000 | Crystal 22.0000MHz 30ppm 13pF 40 Ohm -20°C - 70°C Surface Mount 4-SMD, No Lead (DFN, LCC) | datasheet.pdf | |
![]() | TSW-108-10-T-S-RA | CONN HEADER 8POS .100" SNGL R/A | datasheet.pdf | |
![]() | Q48T20025-PAC0 | DC/DC CONVERT 2.5V 20A | datasheet.pdf | |
![]() | CMF60750K00FHEA | RES 750K OHM 1W 1% AXIAL | datasheet.pdf | |
![]() | PRMC1-D5-S5-S | CONVERT DC/DC 1W 5V 200MA OUT | datasheet.pdf | |
![]() | 150-80-422-00-106101 | DIL SURFACE MOUNT 2.54MM | datasheet.pdf | |
![]() | 410-83-266-41-001101 | Connector Socket 66 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | 811-SS-003-30-022101 | CONN SPRING LOAD 3POS SNGL SMD | datasheet.pdf | |
![]() | AP-1000 | XFMR 50/60HZ PCB CL 0.2 1000:1 | datasheet.pdf | |
![]() | VJ0805D110KXPAC | CAP CER 11PF 250V NP0 0805 | datasheet.pdf | |
![]() | BFC238560511 | CAP FILM 0.00051 UF 5 % 2KVDC RA | datasheet.pdf |