Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MR0A08BYS35 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Mold Compound Update 15/Dec/2014 | |
| PCN Assembly/Origin | Assembly Subcontractor Addition 30/May/2014 Assembly Subcontractor Revision A 03/Jun/2014 | |
| Standard Package | 135 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | MRAM (Magnetoresistive RAM) | |
| Memory Size | 1M (128K x 8) | |
| Speed | 35ns | |
| Interface | Parallel | |
| Voltage - Supply | 3 V ~ 3.6 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 44-TSOP (0.400", 10.16mm Width) | |
| Supplier Device Package | 44-TSOP2 (10.2x18.4) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MR0A08BYS35 | |
| Related Links | MR0A0, MR0A08BYS35 Datasheet, Everspin Technologies Inc. Distributor | |
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