Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MS27466T17F6PB-LC | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | Military, MIL-C-38999 Series I, DJT | |
| Packaging | Bulk | |
| Connector Type | Receptacle for Male Contacts | |
| Number of Positions | 6 | |
| Shell Size - Insert | 17-6 | |
| Shell Size, MIL | - | |
| Contact Type | Crimp | |
| Contact Size | 12 | |
| Mounting Type | Panel Mount, Flange | |
| Fastening Type | Bayonet Lock | |
| Orientation | B | |
| Shell Material, Finish | Aluminum, Nickel Plated | |
| Ingress Protection | Environment Resistant | |
| Features | - | |
| Note | Contacts Not Provided | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MS27466T17F6PB-LC | |
| Related Links | MS27466T, MS27466T17F6PB-LC Datasheet, TE Connectivity Deutsch Connectors Distributor | |
![]() | B82464A4682M | FIXED IND 6.8UH 3.5A 27 MOHM SMD | datasheet.pdf | |
![]() | 1583684-3 | DIE SET D CONN SIZE 10.0 | datasheet.pdf | |
![]() | LQP03TN3N0B02D | FIXED IND 3NH 450MA 250 MOHM SMD | datasheet.pdf | |
![]() | DP-241-4-20L | XFRMR LAMINATED 6VA CHAS MOUNT | datasheet.pdf | |
![]() | VI-230-EX-S | CONVERTER MOD DC/DC 5V 75W | datasheet.pdf | |
![]() | VI-B3F-MU-F1 | CONVERTER MOD DC/DC 72V 200W | datasheet.pdf | |
![]() | AML24FBE2DA01 | SWITCH ROCKER DPDT 100MA 125V | datasheet.pdf | |
![]() | CAT16-3301F4LF | RES ARRAY 4 RES 3.3K OHM 1206 | datasheet.pdf | |
![]() | GT.50X84P2 | GRIP TIE 8X.5" YELLOW | datasheet.pdf | |
![]() | PHP00805H6120BBT1 | RES SMD 612 OHM 0.1% 5/8W 0805 | datasheet.pdf | |
![]() | 5700GN1 | STATICIDE PREM ESD PAINT GRN GAL | datasheet.pdf | |
![]() | EP7311-EV-C | HIGH-PERFORMANCE, LOW-POWER SYSTEM-ON-CHIP WITH SDRAM AND ENHANCED DIGITAL AUDIO INTERFACE IC | datasheet.pdf |