Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MS27467E17B6S-LC | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Circular Connectors - Housings | |
Series | * | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MS27467E17B6S-LC | |
Related Links | MS27467E, MS27467E17B6S-LC Datasheet, Amphenol Aerospace Operations Distributor |
![]() | SN74F251BDR | IC 1-8 DATASELCT/MUX 3ST 16-SOIC | datasheet.pdf | |
![]() | RG1005N-121-W-T1 | RES SMD 120 OHM 0.05% 1/16W 0402 | datasheet.pdf | |
![]() | VI-23T-CX-B1 | CONVERTER MOD DC/DC 6.5V 75W | datasheet.pdf | |
![]() | VI-J7M-CZ-F4 | CONVERTER MOD DC/DC 10V 25W | datasheet.pdf | |
![]() | RWR89S3R32FSS73 | RES 3.32 OHM 3W 1% WW AXIAL | datasheet.pdf | |
![]() | RN60E1822FRSL | RES 18.2K OHM 1/4W 1% AXIAL | datasheet.pdf | |
![]() | 18-6501-20 | CONN IC DIP SOCKET 18POS TIN | datasheet.pdf | |
![]() | RMCF0603FG825R | RES SMD 825 OHM 1% 1/10W 0603 | datasheet.pdf | |
![]() | 87345-438HLF | HEADER BERGSTIK | datasheet.pdf | |
![]() | ATS-19B-138-C3-R0 | HEATSINK 25X25X15MM L-TAB T412 | datasheet.pdf | |
![]() | CXM-6-40-90-18-AA00-F2-3 | LED COB WHT | datasheet.pdf | |
![]() | XC2V40FG256-5C | IC FPGA 684 I/O 957FCBGA | datasheet.pdf |