Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-MS27473T18B53SA-LC | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | MS27473T18B53SA-LC | |
| Related Links | MS27473T1, MS27473T18B53SA-LC Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | RT0402BRE0782RL | RES SMD 82 OHM 0.1% 1/16W 0402 | datasheet.pdf | |
![]() | TNPW2512750RBEEY | RES SMD 750 OHM 0.1% 1/2W 2512 | datasheet.pdf | |
![]() | FXO-HC726R-40 | OSC XO 40.000MHZ HCMOS SMD | datasheet.pdf | |
![]() | R60060-1COR | FUSE BLOCK CART 600V 60A CHASSIS | datasheet.pdf | |
![]() | MP3V5010GP | IC PRESSURE SENSOR 8-SOP | datasheet.pdf | |
![]() | 0LEC0AASX | FUSE HLDR CART 600V 30A IN LINE | datasheet.pdf | |
![]() | A54SX16-1CQ256B | IC FPGA 180 I/O 256CQFP | datasheet.pdf | |
| CKG57NX5R1H226M500JJ | CAP CER 22UF 50V X5R SMD | datasheet.pdf | ||
![]() | ATS-12G-69-C3-R0 | HEATSINK 45X45X20MM L-TAB T412 | datasheet.pdf | |
![]() | ATS-04B-95-C1-R0 | HEATSINK 40X40X30MM R-TAB | datasheet.pdf | |
![]() | ATS-20C-111-C2-R1 | HEATSINK 60X40X9.5MM XCUT T766 | datasheet.pdf | |
![]() | LT3669IUFD#TRPBF | IC IO-LINK TXRX BUCK/LDO 28QFN | datasheet.pdf |