Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-MS27497E10B13SA | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Circular Connectors | |
Series | * | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | MS27497E10B13SA | |
Related Links | MS27497, MS27497E10B13SA Datasheet, Amphenol Aerospace Operations Distributor |
![]() | MAX488CPA+ | IC TXRX RS485/RS422 LOWPWR 8-DIP | datasheet.pdf | |
![]() | B82422A1153K100 | FIXED IND 15UH 165MA 1.85 OHM | datasheet.pdf | |
![]() | VI-BWD-CX-F1 | CONVERTER MOD DC/DC 85V 75W | datasheet.pdf | |
![]() | RWR80N6040FRRSL | RES 604 OHM 2W 1% WW AXIAL | datasheet.pdf | |
![]() | M55342K12B1B14RWS | RES SMD 1.14KOHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | GRM1555C1E4R7CA01D | CAP CER 4.7PF 25V NP0 0402 | datasheet.pdf | |
![]() | 0386906130 | Connector Barrier Block Strip 30 Circuit 0.325" (8.26mm) | datasheet.pdf | |
![]() | ATS-20H-156-C3-R0 | HEATSINK 40X40X25MM L-TAB T412 | datasheet.pdf | |
![]() | ERJ-PA3J7R5V | RES SMD 7.5 OHM 5% 1/4W 0603 | datasheet.pdf | |
![]() | 1528659-6 | HD INDL NON-AMP APPLI | datasheet.pdf | |
![]() | BK/GDA-V-6.3A | FUSE CERAMIC 6.3A 250VAC 5X20MM | datasheet.pdf | |
![]() | 10AS057K2F40E2SG | IC SOC FPGA 588 I/O 1517FBGA | datasheet.pdf |